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specification ieee 802.11 b/g/n 2.4ghz 1t1r wifi with bluetooth2.1 /3.0/4.0,and fm controller wi th sdio interface, and hs-uart mixed interface SM02BS (realtek rtl8723bs) combo module version 1.1
product description SM02BS is a small size and low profile of wi fi+bt combo module with lga (land-grid array) footprint, board size is 14mm*14mm with module height of 2mm. it can be easily manufactured on smt process and highly suit able for tablet pc, ultra book, mobile device and consumer products. it provides gspi/sdio interface for wifi to connect with host processor and high speed uart in terface for bt. it also has a pcm interface for audio data transmission with direct link to external audio codec via bt controller. the wifi throughput can go up to 150mbps in theory by using 1x1 802.11n b/g/n mimo technology and bluetooth can support bt2.1+edr/bt3.0 and bt4.0. SM02BS uses realtek rtl8723bs, a highly inte grated wifi/bt single module based on advanced coms process. rtl8723bs integr ates whole wifi/bt function blocks into a chip, such as sdio/uart, mac, bb, afe, rfe, pa, eeprom and ldo/swr, except fewer passive components remained on pcb. product features ? operate at ism frequency bands (2.4ghz) ? gspi/sdio for wifi and uart for bluetooth ? ieee standards support: ieee 802.11b, ieee 802.11g, ieee 802.11n, ieee 802.11d, ieee 802.11e, ieee 802.11h, ieee 802.11i ? fully qualified for bluetooth 2.1 + edr specification including both 2mbps and 3mbps modulation mode ? fully qualified for bluetooth 3.0 ? fully qualified for bluetooth 4.0 dual mode ? full ?speed bluetooth operation with piconet and scatternet support. ? enterprise level security which can apply wpa/wpa2 certification for wifi. ? wifi 1 transmitter and 1 receiver allow data rates supporting up to 150 mbps downstream and 150 mbps upstream phy rates ? for wifi/bt, it uses fixed path for wifi and bt, which means one antenna assigned for wifi and the other is assigned for bt. ? support bluetooth adaptive power management mechanism ? full-featured software utility for ea sy configuration and management ? rohs compliance ? low halogen compliance
diagram rtl8723bs with shared antenna between wlan and bluetooth rtl8723bs with antenna diversity
product specifications wifi: eee 802.11b, ieee 802.11g, ieee 802.11n, ieee 802.11d, ieee 802.11e, ieee 802.11h, ieee 802.11i standards bt: v2.1+edr/bt v3.0/bt v3.0+hs/bt v4.0 bus interface wifi: gspi/sdio bt: uart data rate 802.11b: 11, 5.5, 2, 1 mbps 802.11g: 54, 48, 36, 24, 18, 12, 9, 6 mbps 802.11n: mcs 0 to 7 for ht20mhz mcs 0 to 7 for ht40mhz bt: 1 mbps for basic rate 2,3 mbps for enhanced data rate 6,9,12,18,24,36,48,54 mbps for high speed media access control wifi: csma/ca with ack bt: afh, time division modulation techniques 802.11b: cck, dqpsk, dbpsk 802.11g: 64 qam, 16 qam, qpsk, bpsk 802.11n: 64 qam, 16 qam, qpsk, bpsk bt: 8dpsk, /4 dqpsk, gfsk network architecture wifi: ad-hoc mode (peer-to-peer ) infrastructure mode software ap wifi direct bt: pico net scatter net main chipset rtl8723bs (realtek)
11: (ch. 1-11) ? united states 13: (ch. 1-13) ? europe 14: (ch. 1-14) ? japan bt 2.4ghz: ch. 0 ~78 frequency range 2.400ghz ~ 2.4835 ghz 802.11b@11mbps 16dbm 802.11g@6mbps 15dbm 802.11g@54mbps 14dbm 802.11n 13dbm (mcs 0_ht20) 13dbm (mcs 7_ht20) 12dbm (mcs 0_ht40) 12dbm (mcs 7_ht40) transmit output power ? 1x1 (tolerance:1.5dbm) bt: max +10dbm 802.11b@11mbps -82dbm 802.11g@54mbps -71dbm 802.11n -67dbm (mcs 7_ht20) -64dbm (mcs 7_ht40) receiver sensitivity bt: -89dbm@1mbps, -90dbm@2mbps, -83dbm@3mbps security wifi : wpa, wpa-psk, wpa2, wpa2-psk, wep 64bit & 128bit, ieee 802.11x, ieee 802.11i bt: simple paring operating voltage 3.3 v 9% i/o supply voltage os supported linux/android power consumption (3.3v) (typical) wifi only tx mode: (conituous mode) 85ma (mcs7/bw40/13dbm) rx mode: (conituous mode) 75ma (mcs7/bw40/-60dbm) associated idle with dtim=1 2.1ma unassociated idle: 0.1ma rf disable mode: 0.1ma bt : inquiry & page scan: 0.9 ma acl no traffic: 7.5ma sco hv3: 15ma operating channel wifi 2.4ghz:
mechanical length width height dimensions (mm) 14 (tolerance: 0.2mm) 14 (tolerance: 0.2mm) 1.6 (tolerance: 0.2mm)
module pin assignment pin function description 1 gnd ground 2 pav33 3.3v 3 aux ant bt antenna 4 gnd ground 5 led_bt shared with led1. bt uart data in 6 led_wlan led pin (active low), shared with gpio8 7 gnd ground 8 main ant rf antenna 9 gnd ground 10 wl_dis shared with gpio9 this pin can ex ternally shutdown the rtl8723bs wlan function when bt_disn is pulled low. when this pin deasserted, sdio interface will be disabled. this pin can also support the wlan ra dio-off function with host interface remaining connected. 11 wl_dev_wake_host general purpose input/output pin 12 bt_dis general purpose input/output pin 13 chip_en this pin can externally shut down the rtl8723bs (no extra power switch required). when this function is not required, external pull high is required.
14 pcm_out pcm data out, shared with gpio1 15 pcm_in pcm data input, shared with gpio0 16 pcm_clk pcm synchronization control, shared with gpio2 17 pcm_sync pcm_sync 18 susclk_in shared with gpio6. external 32k or rtc clock input with 1.8v ~ 3.3v swing. this clock source is configured by bt and wl fw, respectively. 19 uart_in high-speed uart data in 20 bt_host_wake_dev shared with gpio13 the host wakes up the wlan and bluetooth controller in remote wakeup mode. 21 bt_dev_wake_host shared with gpio14 this pin is shared with both wifi and bt functions to wakeup the host when the remote wake function is enabled. the polarity can be defined by the customer. 22 vdd_io / vio_fm vdd for gpio0 to gpio3 and gpi9to gpio15 (3.3v~1.8v) 23 vdd_sdio vdd for sdio and uart pin, the power supply is same as the signal level of sdio bus and uart bus (3.3v~1.8v) 24 uart_rts high-speed uart rts 25 clk_req shared with gpio15. when rtl8723b xtal clock is fed from host chipset, it will assert clkreq to request xtal clock. otherwise, rtl8723bs will de-assert clkreq to indicate host chipset that there is no need to output the xtal clock to rtl8723bs. this signal is used for power saving control with host chipset. 26 uart_cts high-speed uart cts 27 uart_out high-speed uart data ou 28 sdio cmd sdio command input 29 sdio data3 sdio data line 3 30 sdio data2 sdio data line 2 31 sdio data1 sdio data line 1 32 sdio data0 sdio data line 0 33 sdio clk sdio clock input 34 gnd ground 35 vin33 vdd3.3v for digital io (gpio6, led 1, eesk and eecs) 36 vbat_in battery ldo input, 5.5v ~ 2.8v 37 fm_rout fm analog audio output r 38 fm_lout fm analog audio output l 39 fm_rxin2 fm rf rx input n 40 fm_rxin1 fm rf rx input p 41 gnd ground 42 32khz_clk_fm 32.768khz clock input 43 fm_en this pin is used to turn on/off fm radio receiver. 44 fm_scl fm i 2 c clock 45 fm_sda fm i 2 c data 46 reserved general purpose input/output pin
wifi\bt rf circuit reference pictures note: the rf part layout must do 50 ? impedance. can't get the line go 90 can't get the line longer than 15 mm. sdio interface circuit reference pictures fm interface circuit reference pictures
recommended reflow profile referred to ipc/jedec standard. peak temperature : <250c number of times : 2 times environmental operating operating temperature: 0c to +70 c relative humidity: 5-90% (non-condensing) storage temperature: -40c to +80c (non-operating) relevant humidity: 5-95% (non-condensing) mtbf caculation over 150,000hours
wireless module before the smt note: 1.when customers open stencil must be sure the hole bigger to the wireless module plate, please press 1 to 1 and 0.7 mm is widened to open outward, the thickness of 0.12 mm. 2.can't get the wifi module bare hands when needs,must we wear the gloves and static ring. 3.the furnace temperature according to the size of the customer the mainboard ,generally like to stick on a tablet standard temperature of 250 + - 5,can do 260 + - 5. storage and use wifi module control should pay attention to the following matters: 1. module of the storage life of vacuum packaging 1-1.storage life 12 months. storage conditions:<40 . relative humidity:<90%r.h. 1-2.after this bag is opened , devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing must be : 1-3. check the humidity card :stored at 20%rh.if : Q 30%~40%(pink)or greater than 40%(red). labeling module has moisture absorption. mounthed within 168 hours at factory conditions of: t 30% Q 60%r.h. Q once opened, the workshop the preservation of life for 168 hours. 1-4.if baking is required,devices may be baked for: modules must be to remove module moisture problem. baking temperature: 125 , 8 hours. after baking, put proper amount of desiccant to seal packages. 1-5.module vacuum packing 2000 pcs per disc. 2.module reel packaging items as follows. 2-1.storage life 12 months. storage conditions:<40 . relative humidity:<90%r.h. 2-2.module apart packing after 168 hours to launch patch need to bake, to remove the module hygroscopic, baking temperature conditions 125 8hours. 2-3.reel packing 2000 pcs or 1000 pcs per disc. 3.module pallet packaging items as follows 3-1. storage life 3 months. storage conditions:<40 . relative humidity:<90%r.h. 3-2.module if not used within 48 hours, before launch the need for baking, baking temperature: 125 , 8 hours. 3-3.pallet packaging each plate is 100 pcs to 1000 pcs or 2000 pcs shipment. wifi ?????? 1. ????? wifi ????? 1 1 0.7mm ? 0.12mm. 2. ? wifi ???????? . 3. ?????????? ? 250+-5 ? 260+-5 wifi ?p??? 1. ????? 1-1. ? 12 F?? <40 ?? <90%r.h. 1-2. ?? smt ???? 1-3. ????? 30% ? 30%~40%( ?? ? 40% ???? . ???? 30% Q 60%r.h Q ???? 168 ? . 1-4. ? 168 ????VV ?oV???? . V? 125 8 ? . V????? . 1-5. ???? 2000pcs ???? <1> 2. ??? 2-1. ? 12 F?? <40 ?? <90%r.h. 2-2. ???? 168 ????oV??? ??V? 125 8 ? 2-3. ????? 2000pcs ? 1000pcs. 3. ??? 3-1. ? 3 F?? <40 ?? <90%r.h. 3-2. ? 48 ???????VV? 125 8 ? 3-3. ???? 100pcs 1000pcs 2000pcs .

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